不良现象中英文对照表 1.缺件(missing parts) 2.错件(wrong parts) 3.多件(excessive parts) 4.短路(short) 5.断路(open) 6.线短(wire short) 7.线长(wire long) 8.拐线(wire poor ddress) 9.冷焊(cold solder) 10.包焊(excess solder) 11.空焊(missing solder) 12.锡尖(solder icicle) 13.锡渣(solder splash) 14.锡裂(soder crack) 15.锡洞(pin hole) 16.锡球(solder ball) 17.锡桥(solder bridge) 18.滑牙(screw loose) 19.氧化(rust) 20.异物(foreigner material) 21.溢胶(excessive glue) 22.锡短路(solder bridge) 23.锡不足(solder insufficient) 24.极性反(wrong polarity) 25.脚未入(pin unseated) 26.脚未出(pin unvisible) 27.脚未剪(pin no cut) 28.脚未弯(pin not bent) 29.缺盖章(missing stamp) 30.缺标签(missing label) 31.缺序号(missing s/n) 32.序号错(wrong s/n) 33.标签错(wrong label) 34.标示错(wrong mark) 35.脚太短(pin short) 36.j1不洁(j1 dirty) 37.锡凹陷(solder scooped) 38.线序错(w/l of wire) 39.未测试(no test) 40.vr变形(vr deformed) 43.零件沾胶(glue on parts) 41.pcb翘皮(pcb peeling) 42.pcb弯曲(pcb twist) 44.零件脚长(parts pin long) 45.浮件(parts lift) 46.零件歪斜(parts tilt) 47.零件相触(parts touch) 48.零件变形(parts deformed) 49.零件损坏(parts damaged) 50.零件脚脏(pin dirty) 51.零件多装(parts excess) 52.零件沾锡(solder on parts) 53.零件偏移(parts shift) 54.包装错误(wrong packing) 55.印章错误(wrong stamps) 56.尺寸错误(dimension wrong) 57.二极管坏(diode ng) 58.晶体管坏(transistor ng) 59.振荡器坏(x’tl ng) 60.管装错误(tubes wrong) 61.阻值错误(impedance wrong) 62.版本错误(rev wrong) 63.电测不良(test failure) 64.版本未标(non rev lebel) 65.包装损坏(packing damaged) 66.印章模糊(stamps defective) 67.标签歪斜(label tilt) 68.外箱损坏(carton damaged) 69.点胶不良(poor glue) 70.ic座氧化(socket rust) 71.缺ul标签(missing ul label) 72.线材不良(wire failure) 73.零件脚损坏(pin damaged) 74.金手指沾锡(solder on golden fingers) 75.包装文件错(racking doc wrong) 76.包装数量错(packing q’ty wrong) 77.零件未定位(parts unseated) 78.金手指沾胶(glue on golden fingers) 79.垫片安装不良(washer unseated) 80.线材安装不良(wire unseated) 81.立碑(tombstone) 本文来源：https://www.wddqw.com/doc/289f0610cc17552707220870.html